PRODUCTS | Optical Transceivers | 10G XFP BIDI

Features

  • Supports 9.953Gb/s to 11.1Gb/s bit rates
  • Hot-pluggable XFP footprint, Built-in digital diagnos
  • Maximum link length of 10km with SMF
  • 1270nm DFB laser and PIN photodiode
  • XFP MSA package with duplex LC connector
  • No reference clock required
  • Single +3.3V power supply
  • Power dissipation <1.5W
  • Compatible with RoHS
  • Temperature range:0 to +70°C

Applications

  • SONET OC-192&SDH STM-64 at 9.953Gbps
  • 10GBASE-LR/LW 10G Ethernet
  • 1200-SM-LL-L 10G Fibre Channel
  • 10GE over G.709 at 11.09Gbps
  • OC192 over FEC at 10.709Gbps
  • Other optical links, up to 11.1Gbps

Description

Springtek XFP+ BIDI module is compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 9.953~11.1Gbps, and transmission distance up to 10km on SMF.

The transceiver module comprises a transmitter with 1270nm DFB laser and a receiver with a PIN photodiode.Transmitter and receiver are separate within a wide temperature range and offers optimum heat dissipation and excellent electromagnetic shielding thus enabling high port densities for 10GbE systems.

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Package Part Number TX RX Fiber Length Output Power Sensitivity Connector Temp Data Sheet
10G-XFP-BIDI-LR S-XB1023L10-CD 1270nm DFB PIN 10km -3~+2dBm <-14.5dBm LC C
10G-XFP-BIDI-LR S-XB1032L10-CD 1330nm DFB PIN 10km -3~+2dBm <-14.5dBm LC C
10G-XFP-BIDI-LH S-XB1023L20-CD 1270nm DFB PIN 20km -3~+2dBm <-14.5dBm LC C
10G-XFP-BIDI-LH S-XB1032L20-CD 1330nm DFB PIN 20km -3~+2dBm <-14.5dBm LC C
10G-XFP-BIDI-ER S-XB1023L40-CD 1270nm DFB PIN 40km -1~+5dBm <-15dBm LC C
10G-XFP-BIDI-ER S-XB1032L40-CD 1330nm DFB PIN 40km -1~+5dBm <-15dBm LC C
10G-XFP-BIDI-ER+ S-XB1023L60-CD 1270nm DFB APD 60km +1~+6dBm <-20dBm LC C
10G-XFP-BIDI-ER+ S-XB1032L60-CD 1330nm DFB APD 60km +1~+6dBm <-20dBm LC C
10G-XFP-BIDI-ZR S-XB1045L80-CD 1490nm EML APD 80km -1~+4dBm <-23dBm LC C
10G-XFP-BIDI-ZR S-XB1054L80-CD 1550nm EML APD 80km -1~+4dBm <-23dBm LC C